Les différents boitiers
Les boitiers des circuits intégrés :
BGA (Ball Grid Array)
CDIP SB (Side-Braze Ceramic Dual In-Line Package)
DIP (Dual In-Line), PDIP (Plastic DIP)
LCCC (Leadless Ceramic Chip Carrier)
PGA (Pin Grid Array), LCPGA (Lead Ceramic PGA)
PLCC (Plastic Leaded Chip Carrier)
PQF (Plastic Quad Flatpack)
QFP (Quad Flat Package), SQFP (Shrink QFP), TQFP (Thin QFP)
SIP (Single In-Line Leaded Memory Package)
SIMM (Sigle In-Line Leadless Memory Module)
SOJ (Small Out-Line J-Lead)
SOP (Small Out-Line Package), PSOP (Plastic SOP), SSOP (Shrink SOP)
TSOP (Thin Small Out-Line Package)
Les boitiers des composants discrets :
DO-15, DO-35, DO-41, DO-214C (SMA), DO-214AA(SMB), DO-214AB(SMC), DIP,
GBU, GBPC,
KBL, KBU, KBPM,
LL-34,
SC70-5, SC70-6, SC75-6, SDIP,
SOD-123, SOIC-4, SOIC-8, SOIC-14, SOIC-16, SOP-8,
SOT-23, SOT-89, SOT-223, SOT-227,
SOT-323, SOT-563F, SOT-623F,
TO-18, TO-126, TO-92, TO-92L, TO-92S, TO-220, TO-220AC, TO-226AE, TO-220F,
TO-251, TO-251-2L, TO-251-3L, TO-252-2L, TO-252-3L, TO-264, TO-3P, TO-3PF,
TSSOP-8,
WOB.
